| 摘要 |
PURPOSE:To enable to perform a high-precise aligning even if a large number of film layers accumulate, by a method wherein an aligning mark is formed in a projection, the sides thereof are formed in a taper, and the upper end is formed in a knife edge. CONSTITUTION:An aligning mark 3 is formed in a projection on a surface of a wafer or other substrates 4. The mark 3 has tapered sides, a triangular cross section, and an upper end 5 formed in a knife edge. In case a mark 3 is employed, te detection of the mark position by an electronic beam is such that a knife edge 5 at the upper end of the mark 3 is detected, and this improves a detection precision. Additionally, even if a large number of film layers accumulate on the mark 3, the mark can be recognized as a projection, and this permits the reliable detection and aligning of a mark position. |
