发明名称 |
TRANSFER LAMINATING METHOD FOR COPPER SHEET AND FILM AND LAMINATE |
摘要 |
A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate. |
申请公布号 |
JPS5787359(A) |
申请公布日期 |
1982.05.31 |
申请号 |
JP19810148894 |
申请日期 |
1981.09.22 |
申请人 |
GENERAL ELECTRIC CO |
发明人 |
ERITSUKU RIFUSHIIN;JIYOSEFU DEIBITSUDO KAAGIORI;SUTEFUAN JIYAN SUKORODA;JIYOO UONGU |
分类号 |
C23C14/06;B32B15/08;C23C14/00;H05K3/02;H05K3/38 |
主分类号 |
C23C14/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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