| 摘要 |
PURPOSE:To prevent the breakage and the deformation of the device housing and the lead terminal for the subject semiconductor device by a method wherein a plurality of concaved sections are provided around the rotating shaft of a rotary plate, the device to be tested is placed in the container and centrifugal force is given in the state wherein the container is fixed after paraffin has been filled in. CONSTITUTION:A square or cylindrical hollow metal container 14, as a jig, is placed in the concaved sections provided on a metal rotary plate. Fused paraffin 15 is filled in from the inlet in such a manner that the device will be enveloped by the paraffin. After the above has been cooled to the normal temperature and the paraffin 15 has been hardened, the cover is screwed in, the rotary plate is placed in the concaved section, the cover is put on and roatated, and the constant acceleration test is performed using centrifugal force. Through these procedures, the complicated processing, wherein the shape of jig container is to be matched to the external shape of the device, can be unnecessitated, and the undesired load which will be applied on a package and a lead terminal due to the filling of paraffin can also be prevented. |
