Two-dimensional infra red detector array read=out - has individual elements sandwiched between two substrates with low temp. solder union and read=out circuit in supporting substrate

摘要

The detector array consists of a matrix of detector elements (4) each consisting of a distinct island with parallel faces. These are located in mechanical and electrical contact with a substrate (1) covered with an insulating layer (12) except for the electrical contact regions (11) to which the detectors are fixed by an intermediate conducting layer (3). The detectors are covered with a transparent semiconductor layer (2) and are connected by an assembly of conducting lands (21) which are then connected to a network of interconnections on the face of the substrate. The lower substrate, pref. of silicon, contains reading elements such as charge transfer, charge injection or MOS transistor devices. The conducting layer (3) is formed from a low temp. fusion solder such as indium. The upper substrate has a thermal expansion coefficient as close as possible to that of the lower substrate. The lower substrate is formed with its readout elements and insulating layer, coated with a solder layer. The individual detector elements are held in a matrix registered with the lower substrate and attached before the matrix is removed. The upper substrate is then added.