| 摘要 |
PURPOSE:To surely support a sample by providing a sample loading surface with a spiral groove surrounding a center and extending toward the circumference in a sampling stand supporting a platy sample on the sample loading surface by vacuum adsorption. CONSTITUTION:A throgh hole 2 is provided at the central section of a round sampling stand and the whole surface of a sample loading surface 10 is grinded to serve as a reference plane for reforming a wafer. A spiral groove 9 is formed by extending to the circumference section from around the through hole 2 on the sample loading surface 10. Furthermore, an adsorption hole 4 is formed at the place close to the through hole 2 of the spiral groove 9. In this case, when a wafer which is smaller than the sample loading surface 10 is held by adsprotion, leakage will occur from the groove locating outside of the wafer. However, the wafer can positively be held as the conductance of the groove up to the adsorption hole 4 can sufficiently be maintained at low value. |
