| 摘要 |
The invention relates to a semiconductor lead comprising a copper supply lead and a body connected to the latter and composed of molybdenum or tungsten. The essence of the invention is to connect a material composed of kovar, dumet, nickel or steel in the vicinity of the copper-body joint in such a way as to prevent the formation of an active electrolytic cell between the copper and the body, in particular at high temperatures and high humidities. <IMAGE>
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