摘要 |
<p>A method and product produced thereby of bonding insulation board to a substrate. The method comprises applying by spraying a layer of an adhesive (which may be foamed by water or a fluorocarbon) to a substrate, positioning the insulation board on the substrate in the desired position prior to curing the adhesive followed by curing the adhesive. The adhesive consists of a heated mixture of a polyurethane adhesive and an isocyanate curing catalyst which are admixed at substantially equal viscosities in a proportion to permit curing the adhesive at a temperature of less than 140oF. The insulation board is positioned on the adhesive preferably from about one to about ten minutes after spraying the adhesive layer onto the surface of the substrate.</p> |