| 摘要 |
<p>PURPOSE:To easily detect detection marks by a method wherein the circumference of position detection marks are formed as grounding film surfaces having different light reflection factor from that of the position detection marks and contrast is increased. CONSTITUTION:Semiconductor elements 3, 4 such as IC chips, a thick film resistor 5, wiring pads 6, and thick film wires 7 are provided on the surface of a ceramic substrate 1 and a hybrid integrated circuit is formed. Meanwhile, position detection marks 2 on the substrate 1 are formed on films 8 having remarkably different light reflection factor from that of the marks 2 such as a film consisting of black thick film resistor material. The films 8 are formed with the same process for the thick film resistor 5 by using the same material and mask for the thick film resistor 5. Next, when the wiring pads 6 and the thick film wires 7 are formed by using thick film paste composing gold as the main component, the position detection masks 2 are simultaneously formed by using the same material and the same mask.</p> |
