发明名称 3-5 GROUP COMPOUND SEMICONDUCTOR DEVICE
摘要 PURPOSE:To extend alloy temperature to the high temperature side by using an Au-Be alloy or an Au-Zn alloy containing Ag in a special weight ratio as a P type electrode of a III-V group compound semiconductor. CONSTITUTION:An Au-Be alloy or an Au-Zn alloy containing Ag of 10-95wt% is deposited on a P type GaP substrate, and is subjected to a heat treatment at temperature up to 650 deg.C, thereby alloying being promoted. Hereby, even when a heat treatment is performed at high temperature, a change of contact resistance is eliminated. Further by extending alloying temperature to the high temperature side, yield for manufacture can be raised.
申请公布号 JPS5784166(A) 申请公布日期 1982.05.26
申请号 JP19800160520 申请日期 1980.11.13
申请人 SHARP KK 发明人 KURATA KAZUMINE;MORITA TAKASHI
分类号 H01L21/28;H01L29/43;H01L29/45;H01L33/30;H01L33/40 主分类号 H01L21/28
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