发明名称 METHOD FOR PACKAGING ELECTRONIC COMPONENT
摘要 PURPOSE:To dispense with another part, a heat sink body, and to contrive the miniaturization of an apparatus and a reduction in the manhour at the time of maintenance in the apparatus by mounting directly an electronic part to a holding metal fitting. CONSTITUTION:A conductive plate 2, to which an electronic part 1 to generate heat is electrically connected, is installed on a holding metal fitting 6 fastened in a case body 6 of an electronic apparatus and furthermore, the part 1 is fastened on a vertical wall 3a raised curvedly from the metal fitting 3. That is, the heat of the part 1, which is by operated current conduction on the plate 2 and generates heat, is transmitted to the wall 3a of the metal fitting 3 made of a high-heat conductivity material (such materials as brass and aluminum) and is dissipated to the case body 6 of the electronic apparatus through the vertical wall. Thereby, a heat sink body is dispensed with and with the miniaturization of the apparatus contrived, when the conductive plate 2 is detached at the time of maintenance, this holding metal fitting 3 has only to be removed from the electronic apparatus case body 6 and a reduction in the manhour is contrived.
申请公布号 JPS63190365(A) 申请公布日期 1988.08.05
申请号 JP19870023036 申请日期 1987.02.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KATO TATSURO;MATSUMURA KAZUO
分类号 H05K7/12;H01L23/40;H05K7/20 主分类号 H05K7/12
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