| 摘要 |
PURPOSE:To reduce failure in wire bonding by a method wherein electrode means are formed on a polychromic element substrate and after forming electrodes at the bottoms of grooves formed between each electrode means, dicing is applied to the centers of the electrode means so that the center lines of the grooves may be in parallel with the electrodes. CONSTITUTION:Electrode means 37 are formed on a polychromic luminous element substrate 36 and electrodes 42 are formed at the bottoms of grooves 41 formed between each adjoining electrode means. Next, dicing is applied to almost centers of the electrode means 37 so that the center lines of the grooves 41 may be in parallel with the electrodes 42. The electrode means 37 may unitedly be formed before dicing processing and may individually be formed at the opposite sides of the dicing wires as well. In this way, failure rate in wire bonding is decreased and the utilizing efficiency of the element substrate will not be decreased. |
