| 摘要 |
A solder removing device is disclosed including fibres of temperature-resistant non-metallic material, such as a synthetic polymeric material, for example FEP or PTFE, which are coated with a metal rendering them more receptive to solder flux. The metallized fibres are coated with solder flux rendering them more capable of wetting with molten solder, interstices between the fibres serving to absorb molten solder by capillary attraction. |
