| 摘要 |
PURPOSE:To prevent a glass from being corroded during a plating process, by a method wherein, in case an electrode is formed by a plating method on a semiconductor device with a recess having an exposed junction and being coated with glass, the glass is previously protected with a medicine resistant ink. CONSTITUTION:A wafer 1, wherein a recess is covered with a glass 2, is prepared, and a medicine-resistant resist ink 4 is screen-printed on a region, except a part where an electrode is formed, of the wafer 1. An oxidized film 3 is etched with a mixture liquid of hydrofluoric acid and ammonium fluoride through the mask of the resist ink 4. The wafer 1, continuously, is placed in a nickel plated liquid in pH8 and at 80 deg.C, consisting of nickel sulphite hydrophosphorous acid soda, sodium citrate, and ammonium chloride, to form a nickel-plated layer 5. Finally, the resist ink 4 is removed to complete an electrode forming process. This enables the mass production of plated electrodes without the damage of the glass. |
