发明名称 MASK SPUTTERING
摘要 PURPOSE:To form a highly accurate pattern without any unevenness by performing a sputtering through the first mask with openings corresponding to a desired pattern, placed on a base plate, and the second mask with an opening of large diameter than that of the openings of the first mask, placed on the first mask. CONSTITUTION:The first mask 2 with plural openings 3 corresponding to a desired pattern is placed on a base plate 1, and then the second mask 4 with an opening 5 covering all of the openings 3 of the first mask 2 is placed on the first mask 2. When performing sputtering under such a condition, a sputtered film is formed in a region on the base plate 1, corresponding to the openings 3 of the first mask 2. Thus, since the first mask 2 undergoes no direct irradiation of radiant heat from a sputtering gate 6 by the second mask 4 between the base plate 1 and the sputtering gate 6 and also secondary atoms from the sputtering gate 6 is interrupted by the second mask 4, no warping occurs in the base plate 1.
申请公布号 JPS5776184(A) 申请公布日期 1982.05.13
申请号 JP19800153102 申请日期 1980.10.31
申请人 FUJITSU KK 发明人 MIYAZAKI MASAHIRO;KOSHIKAWA YOSHIO;SASAKI YUUSHI
分类号 G11B5/31;C23C14/04;G11B5/127;H01L21/203;H01L21/31 主分类号 G11B5/31
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