摘要 |
An annealing device has a supporting table for a semiconductor wafer, a plurality of flash discharge lamps arranged so as to surround the semiconductor wafer on the supporting table, and a mirror placed in the vicinity of the flash discharge lamps so as to back-reflect light to the semiconductor wafer. The semiconductor wafer is suddenly and uniformly annealed over its entire area by being exposed to irradiation by the light from the flash discharge lamps. <IMAGE>
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