| 摘要 |
PURPOSE:To simple temperature compensation by embedding heating elements into vessels fitting the base boards used for fixing a pressure resisting element covered by diffusion resisting layers on semiconductor monocrystal boards close to the base boards and controlling the temperature of the pressure sensitive element. CONSTITUTION:A pressure sensitive element is produced, for example, by making the center of n type silicone monocrystal board 2 thin diaphragm 2a and forming p type diffusion resisting layers 3 on the surface of the board 2. The pressure sensitive element 1 is airtightly adhered to silicone boards 4 through soldering glass 5a and then airtightly adhered to ceramic vessels 6 through soldering glass 5b. A layer consisting of the silicone boards 4 and vessels 6 communicate through a penetration hole 4a, 6a and pressure P1, p2 are applied to the diaphragm 2a. The heating elements 10 to be heated by an electric power source 10 are unified in a body with the vessels 6 close to the silicon boards to control the temperature of the pressure sensitive element 1 to keep at 50 deg.C. Thus, the temperature can be compensated by miniaturized equipment and the small quantity of power supply, preventing errors. |
