| 摘要 |
PURPOSE:To facilitate automatic continuous bonding by handling as it is long film through the entire processes from the processing in which IC chips are attached to the long film until the process to the actual mounting on a substrate to be mounted. CONSTITUTION:The IC chip 1 is bonded to one end 21 of a lead. Then a cut out part is formed at the connecting part between an inner lead holding part 31 and a base film main body 3. A cut in part 8 is formed in base film 3 which fixes and holds the tip of the other end 22 which is to become an outer lead. Then homing treatment of the outer lead which is required at the time when a face up bonding is performed. The lead 22 is bent by this treatment. Then the outer lead bonding is performed by using a bonding device having a bonding tool 11 and cutting tool 12. A connecting part 32' with the film 3 is cut at the same time as the bonding of the outer lead 22 to a wiring pattern 10 on a substrate 9. Thus the mounting as an independent film carrier is completed. |
