| 摘要 |
PURPOSE:To obtain a long-term stable sensor by forming a through hold at a base substrate when an Si base having a through hole at the center and a reduced pressure pellet on the surface is secured to a ceramic base substrate, forming a recess corresponding to the bottom surface of the Si base and filling solder glass for bonding. CONSTITUTION:A pressure sensitive pellet 54 sensing the pressure is secured onto a cylindrical Si base 56 having a through hole at the center. An annular insulating substrate 51 made of ceramic and an annular insulating substrate 51 made of ceramic having a conductive layer on the surface are formed on the base substrate 53 of ceramic package, and the base 56 thus formed is secured from the surface in sequence by the following method. That is, a through hole corresponding to the through hole of the base 56 is formed at the base 53, and a concentric recess 57 is formed at the periphery. Thereafter solder glass 58 is filled while filling in the recess 57 to the side wall 59, thereby securing the bottom of the base 56. |
