| 摘要 |
PURPOSE:To improve the solderability of a solder alloy obtained by contg. a slight amt. of P in a Pb-Sn-Cd alloy and prevent the melting and infiltration of Ag or Au. CONSTITUTION:This solder alloy consists of 10-90wt% Sn, 0.1-5.0wt% Cd, and 0.00001-0.5wt% P, and the balance Pb. Since this solder alloy does not contain any costly metal, it is inexpensive. In soldering, the infiltration of Ag or Au into the molten solder alloy is virtually prevented. Hence, the occurrence of partially annihilating and spheroidizing phenomena in the Ag or Au film on a substrate is obviated. |
