摘要 |
PURPOSE:To prevent phosphor-silicate glass from cracking by a method wherein a ground or power supply wiring is divided into two or more wirings which are smaller than a wiring width determined by the amount of current flowing through the wiring. CONSTITUTION:A metallic wiring for grounding or power supply of an element is formed on a semiconductor substrate 7. At this case a wiring with a large current capacity is divided into small-width wirings 8. With this structure, even phosphor- silicate glass 5 with 1mum or larger wide is grown on metallic wirings, the stress developed between grains is small compared with that on a large-width wiring so that any crack is not created. |