发明名称 WAFER DICING DEVICE
摘要 <p>PURPOSE:To make a notched value uniform in spite dispersion of a wafer thicknes or the like by a method wherein a position of an upper surface of a wafer placed on a table which is movable vertically is detected as a voltage change with a pneumatic micrometer mechanizm, and notching depth is adjusted. CONSTITUTION:Above a table 11 which have a wafer 12 placed and fixed on it, with a jet outlet 13a directed toward an upper surface of the wafer, a nozzle 13 of a pneumatic micrometer mechanizm A is disposed. In the midway along the nozzle 13, AE(acoustic emission) transducer 14 is disposed and connected with a detecting circuit 15. If properly pressurized air is blown out from the jet outlet 13a, with a voltage change obtained in accordance with a gap L, the height of the upper surface of the wafer is detected, and a reference point for notch depth control is obrained. By this method of a notched value in a dicing process is made uniform without in terference through dispersion of wafer thickness or dimension or the like.</p>
申请公布号 JPS5771147(A) 申请公布日期 1982.05.01
申请号 JP19800147906 申请日期 1980.10.22
申请人 TOKYO SHIBAURA DENKI KK 发明人 SUZUKI NOBUKAZU;NAGASHIMA SUMIO;SATOU KENICHI
分类号 H01L21/301;H01L21/00;H01L21/68 主分类号 H01L21/301
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