| 摘要 |
PURPOSE:To enhance reliability of an electronic circuit unit containing high electric power parts by a method wherein a printed wiring plate loading an LSI element module and power transistors are accommodated in a heat conductive case being formed with heat radiating fins on one side face and with a cavity on the other side face, and the wiring plate and the transistors are connected with bent leads. CONSTITUTION:In the casing 1 formed with the heat radiating fins 11 on one side face and with the cavity 12 on the other side face, the ceramic wiring plate 5 loading the LSI module 4 accommodated in leadless package of chip carrier, etc., is adhered on the bottom face 121 at the center part of the cavity 12. Moreover heat radiating metal bodies 61 of the power transistors 6 are fixed to the step bottom parts 122 formed at the circumferential edge parts of the bottom face 121, and the printed wiring plate 5 and the transistors 6 are connected with the leads 63 having the bent parts. Accordingly disconnection trouble to be caused by thermal expansion or vibration is not generated, and equipping structure having superior heat radiability can be obtained. |
