| 摘要 |
PURPOSE:To prevent generation of fault in a semiconductor device to be caused by thermal stress by a method wherein leads and the semiconductor element are connected with bonding wires, and after the bonding wires and the surface of the semiconductor element are coated with a resin, the whole is sealed with the resin. CONSTITUTION:The semiconductor element 13 is put on a mounting substrate 11, the element and the leads 12 are connected with the bonding wires 14, the outside circumferential faces of the wires 14 and the surface of the semiconductor element 13 are coated with a thin film 15 consisting of the water repellent resin, and the mounting substrate 11, a part of the leads 12, the semiconductor element 13 covered with the coating thin film 15 and the bonding wires 14 are sealed with a sealing layer 16 consisting of the epoxy resin. Accordingly invasion of water or impurity is not generated, breakaway or disconnection of wire to be generated by thermal stress is not generated, and the semiconductor device having high reliability can be obtained. |
