| 摘要 |
The invention is a method of sloping thin film materials so that smooth, continuous films may be deposited thereon. By controlling the thickness of resist mask over the materials (as for patterning) relative to ion milling or sputter etching parameters, repeatable slopes and linewidths may be achieved. For use in bubble memory fabrication, the sloping of conductor walls enables propagation bars to be laid down in crossing over relation thereto while enhancing yield.
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