发明名称 LOW-TEMPERATURE ALUMINUM SOLDER
摘要 PURPOSE:To obtain Al solder enabling satisfactory soldering at a low temp. in a nonoxidizing atmosphere without using a flux by preparing solder contg. a specified percentage of Li, Mg, Mn, Ca, Al and Zn. CONSTITUTION:Low temp. Al solder consisting of, by wt., <=3% of at least one of Li, Mg, Mn and Ca, 2-8% Al and the balance Zn with inevitable impurities or further contg. 1-6% Ag is prepared. Desirable solder consists of 2-8% Al, 1-6% Ag, at leat one of <=1% Li, <=2% Mg, <=0.5% Mn and <=1.5% Ca or 0.5-2% in total of Li and Mg, Mg and Mn, or Ca and Mg, and the balance Zn. Thus, an Al alloy can be soldered well at a low temp. without using a flux.
申请公布号 JPS5767142(A) 申请公布日期 1982.04.23
申请号 JP19800139831 申请日期 1980.10.08
申请人 HITACHI SEISAKUSHO KK 发明人 FUKUMAKI TAKASHI;SHIDA TOMOHIKO
分类号 C22C18/00;B23K35/28;C22C18/04 主分类号 C22C18/00
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