发明名称 APPARATUS FOR AUTOMATICALLY REMOVING MOLDED FILM BEFORE FINISH PLATING FOR EXTERNAL LEAD OF MOLDED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To remove an unnecessary molded film with high efficiency, by applying water jet to the unnecessary molded film on a lead frame. CONSTITUTION:After the molded film on a resin-molded seminconductor device lead frame is electrolyzed to swell, the lead frame 1 is carried from the left to the right by means of a roller driving apparatus. On doing this, the pressurized water led from water-pressurizing tanks 11, 11' is formed into high-speed water jet streams through nozzles 12, 12' and jetted to the lead frame 1, thereby to remove an unnecessary molded film.
申请公布号 JPS5766657(A) 申请公布日期 1982.04.22
申请号 JP19800142383 申请日期 1980.10.14
申请人 NOGE DENKI KOGYO:KK 发明人 UMEDA KATSUMI;UMEKAWA KANJI;MINOWA HIRONORI
分类号 H01L23/50;H01L21/48;H01L21/56 主分类号 H01L23/50
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