| 摘要 |
PURPOSE:To reduce the system cost with respect to the manufacture of a resin sealed type semiconductor device by arranging lead frames within an effective area of a metal mold along the carrying direction to mold with resin. CONSTITUTION:Lead frames 18 are arranged respectively one by one from the starting ends to the terminals of cavities 14, 14' provided along the carrying direction of the lead frames 18 of a metal mold, and after seminconductor elements 19 of respective lead frames 18 being accommodated in the cavities 14, 14', resin is injected in a pot of the metal mold, thereby the resin is molded. After that, said resin is carried to a post-cure device, where the post cure for the resin is performed. Further, cutting and processing for respective lead frames 18 are performed, and a plurality of resin sealing type semiconductor devices wherein the semiconductor elements are sealed with resin layers are obrained. |
