发明名称 WIRE BONDING DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable the realization of an extensive motion along with the accomplishment of a higher speed of motion, by mounting a bonding capillary to a linear motor movable in the axial direction and in the circumferential direction and further in the direction perpendicular to the axis. CONSTITUTION:Two shafts 12, 12' for travelling in the Y direction formed with a magnetic material on a fixed stand 11 are provided, and a travelling bodies 13, 13' in the Y direction are arranged so as to ride on the Y direction travelling axis to function as a linear motor that moves a travelling table 14. A rotary axis 15 is fixed on the travelling table 14, and a motional function part and the rotary axis 15 equipped with an arm 16 and a capillary 17 function as a linear motion motor that moves the capillary 17 in the X direction and Z direction. These can be operated freely by simultaneously providing a movement and a rotation and the like including movements in the respective directions of X, Y and Z and a circular motion in a plane.
申请公布号 JPS5766647(A) 申请公布日期 1982.04.22
申请号 JP19800142463 申请日期 1980.10.14
申请人 TOKYO SHIBAURA DENKI KK 发明人 HATANO AKIRA
分类号 B23K20/00;H01L21/60 主分类号 B23K20/00
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