| 摘要 |
PURPOSE:To facilitate matrix wiring between a metal conductor film and an external wiring by means of a tape carrier, by forming a minute pattern by means of the metal conductor film on a substrate. CONSTITUTION:A metal conductor film 12 of Au is formed on an NiCr film of 200-600Angstrom formed as a ground for increasing the bonding strength with a substrate 11. Moreover formed by means of vacuum evaporation or sputtering is a Te film 13, a CdTe film 14, a CdS film 15, a transparent electrode film 16 of SnO2 or In2O5, a light-screening film 17 of Au and a transparent protecting film 18 of Ta2O5. In the parts formed by laminating the abovementioned films, a part 19 consitutes a photodiode, while a part 20 covered with the light-screening film 17 constitutes a blocking diode. The light-receiving element thus formed is connected with a wiring conductor formed on a tape carrier, thereby to conduct matrix wiring. |
