发明名称 |
Connection system of a semiconductor arrangement and method for manufacturing it |
摘要 |
Connection system for a semiconductor arrangement for electrically connecting a terminal part (4) on a conductor (2) of the semiconductor arrangement (1) and a terminal part (7) on a substrate (8) facing the terminal part (4) of the semiconductor arrangement (1) and a method for manufacturing it are disclosed. The connection system exhibits an elastic connection body (9) with connection surface parts which are to be connected to the terminal parts (4, 7), and an elastic conductive rod which is held between the oppositely located connection surface parts. A load developed between the terminal parts (4, 7) of the semiconductor arrangement (1) and of the wiring substrate (8) is absorbed within the elastic area of the rod of the elastically conductive material in order to extend the connection life of the connection system. <IMAGE> |
申请公布号 |
DE3129568(A1) |
申请公布日期 |
1982.04.22 |
申请号 |
DE19813129568 |
申请日期 |
1981.07.27 |
申请人 |
HITACHI,LTD. |
发明人 |
SERIZAWA,KOJI;HONDA,MICHIHARU;SATOH,RYOHEI |
分类号 |
H01L21/60;H01L23/49;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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