| 摘要 |
PURPOSE:To improve the heat dissipating efficiency of a semiconductor module by a method of bonding members having metallic surfaces by supplying a liquid low melting point metal through a penetrating hole formed at one member and bonding the members, thereby preventing the production of a cavity. CONSTITUTION:A semiconductor chip 9 and a heat dissipating copper plate 10 are, for example, superposed via solder flux 14 improving the wettability, and are placed on a heating disc 7. A solder 13 is placed on a penetrating hole 11 formed at the plate 10. A solder resist 12 is provided at the position in the vicinity of the solder 13 of the plate 10. The disc 7 is operated in this state to heat the chip 9, the flux 14 is activated and is arrived at the lower surface of the solder 13. Further, heating is continued to melt the solder 13 to introduce the liquid solder 13 through the hole 11 to the surface 8 to be bonded and to allow the solder to be immersed to between the plate 10 and the chip 9 while pushing the flux 14. At the stage that the solder 13 is immersed to the entire surface to be bonded, the heating is stopped, and it is cooled, thereby obtaining the bonded part containing no cavity and improving the heat dissipating property. |
