| 摘要 |
PURPOSE:To reduce the mounting area of a semiconductor device by a method wherein metalized parts are provided in a cover of sealing case and accessories are fixed thereto, and the metalized parts are connected to the outside lead of the case. CONSTITUTION:The metalized pattern 15 is provided in the case 11, and is connected to the metalized pattern 14 for leading out to an outside electrode. Afrer a semiconductor chip 12 is assembled therein and connection 13 is finished, when the cover 18 is sealed with glass 21, a resistor 19 processed on the cover is connected to the outside lead 22 through the metalized pattern 17 in a through-hole 16 from the metalized pattern 15. When the resistor 19, etc., are accommodated in the case, the mounting area on the printed wiring substrate can be reduced remarkably. |
