| 摘要 |
PURPOSE:To save deflashing work of a semiconductor device by a method wherein a lead frame being provided with crushed parts at lead parts is used. CONSTITUTION:Flatly crushed parts 7 are provided at the neighborhood of boundary where leads 3 for leading outside are to be led out outside from the inside of a resin 5. By this constitution, the end edge of upper face of the lead is a rectangle and has no roundness, and no gap is generated between a metal mold for molding and the lead. Accordingly no resin is oozed out when sealing is to be performed, therefore flash is not generated therein. |
