发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To perform a stable contact bonding for preventing the electric characteristics from being deteriorated by arranging microelectrodes on the central part of the surface and on the peripheral part point-symmetrically with respect to the center when the electrodes are installed on the top of a mesa diode with a small surface area in a contact bonding manner. CONSTITUTION:A plurality of ohmic electrodes 25 are provided on the central part of the surface of the top of the mesa of a diode for a small output having the lower surface electrode 26, and similarly a plurality of microelectrodes 28 are provided on the peripheral part of said surface point-symmetrically to the center. Hereby, it is possible to perform a stable contact bonding without having the tip inclined when installed, thus the deterioration of electrical caracteristics is prevented.
申请公布号 JPS5763872(A) 申请公布日期 1982.04.17
申请号 JP19800139591 申请日期 1980.10.06
申请人 NIPPON DENKI KK 发明人 IWASE KAZUO
分类号 H01L47/02;H01L21/52;H01L29/41;H01L29/864 主分类号 H01L47/02
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