| 摘要 |
Printed circuits are made by depositing a conductor paste on an insulating substrate and heating the paste to render it conductive and adherent to the substrate. This invention provides improved pastes comprising 12 to 25 wt.% boron, up to 35 wt.% glass frit, and the balance being nickel oxide, the combined weight of glass frit and boron being 22 to 45%, all percentages being by weight on a dry basis. The pastes can satisfactorily be fired at 500 to 1100 DEG C. |
