发明名称 PARTIALLY UNDIPPING METHOD IN HOT DIPPING
摘要 PURPOSE:To obtain an undipped face free from scratches on a material to be hotdipped by applying a silicone coating material with high stickiness and a specified treating material to the face requiring no hot dipping, drying and hardening the materials, and carrying out hot dipping. CONSTITUTION:A material 5 to be hot-dipped has a face 3 requiring no hot dipping. A silicone resin coating material 1 with high stickiness is uniformly applied to the surface of the face 3 in a suitable thickness, and a treating material 2 contg. silicone resin varnish as a principal component is further applied to the material 1 in a suitable thickness. The materials 1, 2 are dried and hardened. This material 5 is dipped in a hot dipping agent to hot-dip the face 4, and the treating material layer 2 is removed by peeling.
申请公布号 JPS5763672(A) 申请公布日期 1982.04.17
申请号 JP19800137931 申请日期 1980.09.30
申请人 HIRAO YOSHIROU 发明人 HIRAO YOSHIROU
分类号 C23C2/02;C23C18/16;C23C18/18;C23C18/31;C25D5/02 主分类号 C23C2/02
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