| 摘要 |
PURPOSE:To improve the yield and the reliability of a ceramic substrate for a semiconductor package by improving the corner being formed acutely and the edge of the substrate, thereby preventing cutout and cracks produced at the substrate. CONSTITUTION:A semicircular automatically inserting notch 25 of approx. 1mm. in radius is formed at one longitudinal end face of a seramic substrate 21 (having 2cm of width, 3cm of length and 1.5cm of thickness) formed with planar state of a rectangular parallelepiped, and round parts of approx. 0.4mm. in radius are formed at the corners 23 of the end face of the outer periphery. An edge part 22 formed on the bounday between the opposite surface to the surface perforated with the cavity 24 for containing a semiconductor element and the end face of the outer periphery has a stepwise difference of approx. 0.1mm. along the outer periphery of the substrate 21, and two rounded edges 26, 26' are stepwisely formed. In this manner, it can alleviate the impact force applied to the corner and the edge of the substrate and can disperse the impact force. |
