发明名称 |
Arrangement for feeding a soldering agent to a metal plate |
摘要 |
The arrangement for feeding a soldering agent to a metal plate (1) comprises one or more slit and bent parts (8a) which are formed on the metal plate. Each slit and bent part has a cut end face (8b) at which the material is exposed and to which the soldering agent is fed in order to connect a wire conductor (3a) to it. Furthermore, the arrangement comprises one or more openings (9) which extend in accordance with the slit and bent parts and prevent heat dissipation at the moment of soldering. <IMAGE>
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申请公布号 |
DE3116636(A1) |
申请公布日期 |
1982.04.15 |
申请号 |
DE19813116636 |
申请日期 |
1981.04.27 |
申请人 |
CLARION CO.,LTD. |
发明人 |
NARA,HIROTOSHI;ARAMAKI,MITSUO;SUZUKI,KUNIO |
分类号 |
H05K7/12;B23K1/00;B23K1/20;B23K31/02;H01R43/02;H05K3/20;H05K3/34;H05K3/40;H05K7/02;(IPC1-7):B23K3/00 |
主分类号 |
H05K7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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