| 摘要 |
PURPOSE:To eliminate the need for a large amount of resist, and to reduce manufacturing cost by pasting an acid-proof etching preventive plate together on the surface of a substrate on which an electric circuit is formed through solder and etching the rear of the substrate. CONSTITUTION:The acid-proof etching preventive plate 9 is pasted together on the surface 4 of the wafer 1, on which the resist 7 is applied as a buffering agent, through the solder 8. A Pyrex glass board is prefereble as the preventive plate. The wafer is immersed in an etching liquid under this condition, and the rear back 5 is etched. Accordingly, a large amount of resist are not used for etching the rear of the wafer, the wiping-off of the resist rounding to unnecessary sections is unnecessitated, and manufacturing cost is reduced. |
