| 摘要 |
1. Process for continuous manufacturing of a copper coated substrate for printed circuits, characterized in that there are successively deposited, on a circulating copper band, at least a band of glass fiber (13) and at least a layer of heat hardenable resin, the sandwich which is so constituted is squeezed under low pressure, the sandwich is covered with a band (23) of copper or synthetic material and the resin is polymerized in a continuous oven (25) through which the assembly is circulated. |
