发明名称 LEAD FRAME FOR RESIN-SEALED SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To solve the problem of the bent of a lead and the deterioration of moisture of a lead frame at the time of sealing with resin by opening a long hole at the lead holding region of a supporting frame and holding the lead at the remining fine width part. CONSTITUTION:A lead 3 is held in a cantilever state to a supporting frame 4 disposed around an island is projected to the island, a long hole 2 is opened at the region for holding the lead 3 of the frame 4, and the lead 3 is held at the remaining fine width part of the frame 4 except the long hole. In this manner, the contraction force produced at the time of curing the resin can be absorbed by the deflection of the fine width part formed at the side of the long hole 2, and it can prevent the application of unreasonable force to the lead.
申请公布号 JPS5762549(A) 申请公布日期 1982.04.15
申请号 JP19800137476 申请日期 1980.10.01
申请人 NIPPON DENKI KK 发明人 MASUI TOSHIHIKO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
代理机构 代理人
主权项
地址