| 摘要 |
<p>PURPOSE:To rididly bond a pellet to a package without damaging the pellet by covering a low melting point glass film on the pellt mounting surface of the package, forming an aluminum film having good adhesiveness with the low melting point glass on the pellet and mounting the pellet on the package. CONSTITUTION:A base assembly formed of a ceramic substrate 1 and a low melting point glass film 2 is heated to the working temperature of the low melting point glass, a semiconductor element 4 formed with an aluminum deposited film 5 on the back surface is disposed on the central pellet mounting surface of the base assembly, is heated, is then cooled, and the aluminum deposited film 5 is adhered to the low melting point glass. In this manner, the pellet can be effectively and rigidly mounted and adhered to the package without damaging the semiconductor element, thereby reducing the cost.</p> |
