发明名称 Method and apparatus for dry etching and electrostatic chucking device used therein.
摘要 <p>An electrostatic chucking device for use in dry etching apparatus comprises a supporting base (not shown) the temperature of which is maintained at a predetermined value, an insulator (2) on the supporting base, a pair of plane electrodes (4, 5) in the insulator, and a material (3) being chucked on the pair of plane electrodes, the material containing at least a conductive portion. The sum of the areas of the portions of the plane electrodes which overlap with the material are almost equal to the contact area between the material (3) and the insulator (2). When a voltage is applied between the plane electrodes from an external power source, the material is chucked electrostatically to the supporting base. The electrostatic force attracting the material is maximized by the large area of the electrodes, and further by making the areas of the two electrodes equal.</p>
申请公布号 EP0049588(A2) 申请公布日期 1982.04.14
申请号 EP19810304409 申请日期 1981.09.24
申请人 FUJITSU LIMITED 发明人 ABE, NAOMICHI
分类号 H02N13/00;C23C14/50;H01L21/00;H01L21/683;(IPC1-7):02N13/00;01L21/68;01J37/20 主分类号 H02N13/00
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