| 摘要 |
PURPOSE:To prevent the occurrence of poor chips in an automatic device, by a method wherein the moving status of a bonding tool is detected, measured, and memorized and the moving status is compared with the data at an existing bonding point to optimize the conditions by feeding back the moving status to a control system. CONSTITUTION:A supporting substance 24 is moved so that a tool 13 may be positioned at the upper part of a chip 14 pad to drive a pulse motor 27. With the tool 13 descended and contacted with the pad, arms 20, 41 rotate to send a displacement signal a to a detection means 34 and the motor 27 is stopped by signals b,c. The present position signald before deforming a wire 12 is used as a reference value and memorized in a CPU35. Next, load and ultra-sonic vibration are added by the conditions programmed in the CPU35 and the displacement value of the tool 13 is simultaneously detected for comparison. When it has been confirmed that the wire 12 has been crushed up to the reference value through predetermined steps, the wire 12 moves to the next bonding point by a completion signal i. In this way, bonding sequence can properly be proceeded for easy abnormal detection and the occurrence of poor chips can be prevented. |
