| 摘要 |
PURPOSE:To sufficiently maintain adhesive strength applied when two semiconductor devices are piled up, by widening a part of the leads at the outermost in a resin sealing semiconductor device having a plurality of leads. CONSTITUTION:External leads l2-l7 in a resin sealing 16-pin semiconductor device has conventional shape and in the l1 and l8 at the outermost portion the border section at resin 31 has a conventional dimension E'. Meanwhile, broad sections are composed of a dimension E>;E'. In this composition, when two devices are piled up, as the broad sections 31 of the lead l1 and l8 are wider than conventional ones, adhesive area will not be reduced even if the lead l1 is slightly shifted. Accordingly, adhesive strength will not decreases. And the dimension E' at a sealing section is conventional one. Therefore, the dimension M is also conventional one and crack resistance by thermal shock remains unchanged. |
