| 摘要 |
PURPOSE:To realize an exchange of a defective pellet only with an operation of the wire bonding and at the same time to realize the mounting with high concentration, by previously mounting at a time both a memory pellet and a spare pellet. CONSTITUTION:A wiring substrate containing the prescribed wirings 6 and 6', a repairing wiring 7, bonding pads 4 and 4' plus repairing bonding pads 5 and 5' is formed by an optional method. Then a pellet is mounted on this substrate, and at the same time a spare pellet 1r is also mounted at a prescribed position. After this, the wire bonding is carried out to a prescribed bonding pad, and an electric inspection is given to a memory module. If a defective pellet exists, the bonding wires 2-2'' of the defective pellet are excluded to use the pellet 1r. |
