发明名称 TAPE CARRIER FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To easily bend the tape carrier by a method wherein either of a linear groove or a gap is provided for every fixed unit of the tape carrier and the entire distortion generated at the tape carrier is absorbed by the groove or the gap. CONSTITUTION:The linear groove 8 is provided on the tape carrier 3 by performing a press work and the like. According to this constitution, the groove 8 is coincided with the bent section 7 of the groove 8, the carrier 3 can be easily bent at the bending section 7 and supported along the shape of the guide 1. Accordingly, the lead of the tape carrier is maintained in parallel with the semiconductor device located on the stage, the distance between the tape carrier and the semiconductor can be brought further closer in the amount without deflection, and the above can be connected by performing an accurate positioning. Providing either of the groove 8 and the gap 9 will be enough to accomplish the purpose above-mentioned.
申请公布号 JPS5758346(A) 申请公布日期 1982.04.08
申请号 JP19800132538 申请日期 1980.09.24
申请人 NIPPON DENKI KK 发明人 BONSHIHARA MANABU
分类号 H01L21/60;H01L23/13 主分类号 H01L21/60
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