发明名称 WAFER CHUCK
摘要 PURPOSE:To prevent damage of wafers and resists by providing a plurality of small holes which are communicated to a compressing gas source in a surface of a concave seat of a lower member contacting a convex part of an upper member. CONSTITUTION:A plurality of small holes 14 are provided in surface of the semi-spherical shaped concave seat of the lower member 4A contacting with the semi-spherical shaped convex part 11 of the upper member 3A. Said small holes 14 are communicated with the compressing gas source via a path 15. The water 2 is sucked and fixed to the upper surface of the upper member 3A by vacuum, and the upper member 3A is pushed up by a weak force. Then the compressed air is sent through the path 15 and injected from the small holes 14, and the upper member 3A is floated from the surface of the concave seat 12 of the lower member 4A. Since the upper member 3A is completely floated from the surface of the concave seat 12, vibrating phenomenon is not generated, frictional force between the upper member 3A and the surface of the concave seat 12 becomes almost zero, the pushing up force for the up and down mechanism can be fairly well reduced, and the damage of the wafers and photoresist can be reduced to the nimumum.
申请公布号 JPS5758318(A) 申请公布日期 1982.04.08
申请号 JP19800132807 申请日期 1980.09.26
申请人 HITACHI SEISAKUSHO KK 发明人 IKEDA MINORU
分类号 H01L21/027;H01L21/30 主分类号 H01L21/027
代理机构 代理人
主权项
地址