| 摘要 |
PURPOSE:To make it possible to automate the fabrication of the semiconductor device by a gang bonding method, by forcibly cooling a heater tip during the period from the stop of heater tip heating to the release of pressure application. CONSTITUTION:Semiconductor pellets 4 are arranged and fixed on an arranging board 1 by a bonding agent. Lead frames formed on an insulating film 6 is placed on the pellets. Nozzles 17 are opened in a guide 16 which positions the lead frames so as to surround the heater tip 13. Air and gas from liquid nitrogen are jetted from said nozzles. In this constitution, the tip is forcibly cooled during the period from the stop of the heating of the tip 13 and to the stop of the pressure application of the tip 13. Thus the fabrication of the semiconductor substrate can be automated, the fabrication speed is improved, and the required manhours can be reduced. |
