| 摘要 |
<p>PURPOSE:To enable the manufacture of a semiconductor chip having different size inexpensively by selectively varying the interval of dicing lines and dicing along the dicing lines. CONSTITUTION:Dicing lines of different interval are selectively formed on a semiconductor substrate 1 to form a region of semiconductor chips having different sizes. A photodetector 2 in which many photocells are aligned is faced on the substrate 1, the relfected light on the substrate 1 is measured by the photodetector 2 while the dicing lines x1 is scribed, for example, by a diamond tool 3, and the next dicing line x2 is automatically recognized. In this manner, the next dicing line is sequentially recognized, and is scribed by varying the feeding amount of the tool 3. Such an automatic recognition can be similarly performed in the dicing even by a laser, a dicing saw or the like.</p> |
